Method of manufacturing multilayer wiring board

Details Method of manufacturing multilayer wiring board Method of manufacturing multilayer wiring board

2006-03-28

2006-03-28

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C427S097100, C427S099300

Reexamination Certificate

active

07017264

ABSTRACT:
The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.

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