Method of manufacturing multilayer printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

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Details

2191217, 21912171, 21912174, 427 97, H01K 310

Patent

active

058263306

ABSTRACT:
In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.

REFERENCES:
patent: 3770529 (1973-11-01), Anderson
patent: 4644130 (1987-02-01), Bachmann
patent: 4789770 (1988-12-01), Kasner et al.
patent: 5087396 (1992-02-01), Zablotny et al.
patent: 5194713 (1993-03-01), Eqitto et al.
patent: 5227013 (1993-07-01), Kumar
patent: 5293025 (1994-03-01), Wang
Printed Circuits Technical Handbook,chap. 4.10, Other Organic Insulation Substrate, section 4.10.1 Multilayer Board for Active Method Printed Circuits, p. 363, lines 7-9 (in Japanese).

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