Method of manufacturing multilayer printed wiring board

Details Method of manufacturing multilayer printed wiring board Method of manufacturing multilayer printed wiring board

1993-10-29

1996-01-09

Zimmerman, John

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156249, 1563077, B32B 3120

Patent

active

054825865

ABSTRACT:
Two aluminum-copper foils, each composed of a layer of copper and a layer of aluminum, are held back to back with the aluminum surfaces against each other, thereby providing an outer layer material (20) for a multilayer printing wiring board. To manufacture a multilayer printed wiring board, an outer layer material (20), a prepreg (2), an inner layer laminate (1), a prepreg (3), and an outer layer material (21) are successively stacked or built up in the order named. The aluminum surface of the outer layer material (20) replaces the mirror finished steel plate and dummy plate which have heretofore been employed. Since the aluminum surfaces can easily be separated from each other, they perform the function of conventional parting films. As the aluminum surfaces of the outer layer material (20) are held in intimate contact with each other, resin refuse or foreign matter does not become attached to the aluminum surfaces, and the aluminum surfaces are prevented from being scratched or dented or otherwise made defective. Since mirror finished steel surfaces are not employed, the manufacturing process is simplified, and the buildup operation can be automated. The aluminum foils may be replaced with foils of a plastic metal such as an aluminum alloy, copper, brass, soft iron, a lead alloy, or the like.

REFERENCES:
patent: 4323632 (1982-04-01), Bendan et al.
patent: 4431710 (1984-02-01), Lifshin et al.
patent: 4568413 (1986-02-01), Toth et al.
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4875283 (1989-10-01), Johnston

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