Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2008-06-30
2011-11-08
Alanko, Anita (Department: 1713)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S018000, C216S020000, C216S036000, C029S831000, C029S847000, C029S852000, C427S099200
Reexamination Certificate
active
08052881
ABSTRACT:
A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board.
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Lai Yung-Wei
Liou Shing-Tza
Zhu Yun-Li
Alanko Anita
Altis Law Group, Inc.
FuKui Precision Component (Shenzhen) Co., Ltd.
Zhen Ding Technology Co., Ltd.
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