Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-04-19
2011-04-19
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S792000, C361S795000, C361S803000
Reexamination Certificate
active
07929313
ABSTRACT:
In a method of manufacturing a multilayer printed circuit board, a first insulating resin base material is formed. A resin surface of a second insulating resin base material formed by attaching copper foil on a surface of a resin-insulating layer is unified with the first insulating resin base material. A conductor circuit is formed on the second insulating resin base material and a via hole electrically connecting to the conductor circuit. A concave portion is formed from a resin-insulating layer surface in a conductor circuit non-formation area of the first insulating resin base material. A semiconductor element is housed within the concave portion and adhered with an adhesive. A resin-insulating layer is formed by coating the semiconductor element and a via hole.
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U. S. Office Action dated Jun. 10, 2010 from U.S. Appl. No. 11/611,538.
Ito Sotaro
Mikado Yukinobu
Takahashi Michimasa
Dinh Tuan T
Ibiden Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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