Method of manufacturing multilayer ceramic electronic component

Details Method of manufacturing multilayer ceramic electronic component Method of manufacturing multilayer ceramic electronic component

1994-08-01

1996-07-09

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, 264 65, B32B 3120, B32B 3126

Patent

active

055340920

ABSTRACT:
In order to suppress deviation of conductor films and to effectively remove voids when a laminate obtained by stacking a plurality of ceramic green sheets provided with the conductor films is pressed in the direction of stacking, a pressing step is divided into a preliminary pressing step and a main pressing step which is carried out subsequently thereto. In the preliminary pressing step, a temperature of at least 40.degree. C. is applied to the laminate of the plurality of ceramic green sheets by a heater, while a press head is driven toward the laminate, thereby applying a pressure of not more than 50 kgf/cm.sup.2 to the same. The preliminary pressing step may be further divided into first and second preliminary pressing steps. In the first preliminary pressing step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with the conductor films, so that voids are removed from the regions provided with the conductor films. In the second preliminary step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with no conductor films, so that at least the regions provided with no conductor films are pressed.

REFERENCES:
patent: 5141899 (1992-08-01), Jean et al.
patent: 5174842 (1992-12-01), Hamuro et al.
patent: 5261986 (1993-11-01), Kawabata et al.
patent: 5370760 (1994-12-01), Mori et al.

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