Method of manufacturing multilayer ceramic electronic component

Etching a substrate: processes – Forming or treating material useful in a capacitor

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216 13, 216 20, 216 35, 29 2542, 428209, 361313, B44C 122

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active

055974945

ABSTRACT:
Disclosed herein is a method of manufacturing a multilayer ceramic electronic component by forming external electrodes on a pair of opposite side surfaces of a sintered body (1) obtained by sintering a laminate prepared by stacking a plurality of ceramic green sheets through internal electrodes to be electrically connected with prescribed ones of the internal electrodes. The method of manufacturing a multilayer ceramic electronic component comprises a step of forming the internal electrodes on single major surfaces of the ceramic green sheets by a thin film forming method, a step of electrochemically etching the opposite side surfaces (1a', 1b) of the sintered body (1) for forming gap regions between the internal electrodes and those of the external electrodes which must not be electrically connected with the internal electrodes and a step of filling up clearance portions (A) defined by dissolution/removing of the internal electrodes by the etching with an insulating material.

REFERENCES:
patent: 4685197 (1987-08-01), Tigelaar et al.
patent: 5179773 (1993-01-01), Monsees et al.
patent: 5197170 (1993-03-01), Senda et al.

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