Method of manufacturing multilayer ceramic board

Details Method of manufacturing multilayer ceramic board Method of manufacturing multilayer ceramic board

1978-08-11

1980-12-09

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, H05K 336

Patent

active

042376068

ABSTRACT:
In a method of manufacture of a multilayer ceramic board, a conductor land is formed and baked on a first substrate. A second substrate on which the wiring pattern is formed is then electrically connected to the first substrate via the land. An error in the substrate due to shrinkage at the time of sintering is thereby compensated by the conductor land. This assures the formation of a highly accurate wiring pattern on the sintered substrate surface, despite shrinkage of the ceramic during sintering of the raw sheets of ceramic.

REFERENCES:
patent: 3332137 (1967-07-01), Kenney
patent: 3726002 (1973-04-01), Greenstein et al.
patent: 3772748 (1973-11-01), Rutt
patent: 3798762 (1974-03-01), Harris et al.
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 3968193 (1976-07-01), Langston, Jr. et al.
patent: 3999004 (1976-12-01), Chirino et al.
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4030004 (1977-06-01), Rutt
IBM Tech Discl Bull, vol. 13, No. 7, Dec. 1970, P 1882. _

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