Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-08-21
2000-12-05
Yao, Sam Chuan
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563099, 156311, 156228, 29 2535, 29446, B32B 3104, B32B 3120
Patent
active
061561452
ABSTRACT:
A method for manufacturing a multi-layer piezoelectric transducer having enhanced mechanical output displacement capability resulting from an increase in the amount of "pre-stress" applied to the electroactive (ceramic) layer by the pre-stress layer. The pre-stress layer is heated to a temperature above the temperature of the ceramic layer and bonded at an elevated temperature to the ceramic layer, such that, as the pre-stress layer subsequently cools down to ambient temperature, it applies a compressive stress to the ceramic layer. During the step of cooling the layers to ambient temperature, the temperature drop of the pre-stress layer is greater than the temperature drop of the ceramic layer, thereby increasing the amount of "pre-stress" applied to the electroactive (ceramic) layer by the pre-stress layer.
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Bolduc David J.
Clark Stephen E.
Face International Corp.
Yao Sam Chuan
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