Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2005-05-17
2005-05-17
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S041000, C430S311000, C174S263000, C174S265000, C174S266000
Reexamination Certificate
active
06893576
ABSTRACT:
This invention is a method of manufacturing a multi-layer printed wiring board including an internal layer circuit forming step, a outer layer circuit forming step, and a solder resist forming step. In the solder resist forming step, the surface of a board subjected to the outer layer circuit forming step is coated with a photosensitive solder resist material, the solder resist material is coated with a photosensitive film; a light shielding mask is formed by irradiating a laser beam on the photosensitive film according to a formed pattern of the solder resist, the solder resist material is exposed by using the light shielding mask, the light shielding mask is removed, and the solder resist material which is not exposed is removed.
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Japanese Office Action dated Jun. 15, 2004 in the corresponding Japanese patent Application No. 2000-051406 with English translation.
Hyodo Kiyoshi
Ikeda Akio
Nakayama Akitaka
Uchida Kazuo
Ahmed Shamim
Fujitsu Limited
Norton Nadine G.
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