Method of manufacturing multi-layer printed circuit board

Details Method of manufacturing multi-layer printed circuit board Method of manufacturing multi-layer printed circuit board

2007-02-20

2007-02-20

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000, C427S097700

Reexamination Certificate

active

11106642

ABSTRACT:
Through holes36are formed to penetrate a core substrate30and lower interlayer resin insulating layers50, and via holes66are formed right on the through holes36, respectively. Due to this, the through holes36and the via holes66are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes36and the via holes66to be connected to solder bumps76(conductive connection pins78), respectively, are directly connected to one another, excellent reliability in connection is ensured.

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