Method of manufacturing multi-layer printed circuit board

Details Method of manufacturing multi-layer printed circuit board Method of manufacturing multi-layer printed circuit board

2011-03-22

2011-03-22

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S840000, C029S852000, C438S118000, C438S119000

Reexamination Certificate

active

07908745

ABSTRACT:
An intermediate layer38is provided on a die pad22of an IC chip20and integrated into a multilayer printed circuit board10. Due to this, it is possible to electrically connect the IC chip20to the multilayer printed circuit board10without using lead members and a sealing resin. Also, by providing the intermediate layer38made of copper on an aluminum pad24, it is possible to prevent a resin residue on the pad24and to improve connection characteristics between the die pad24and a via hole60and reliability.

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