Method of manufacturing multi-layer circuit board

Details Method of manufacturing multi-layer circuit board Method of manufacturing multi-layer circuit board

2011-08-30

2011-08-30

Goff, John (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S307100, C029S830000

Reexamination Certificate

active

08007629

ABSTRACT:
A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.

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