Method of manufacturing mounting substrate and surface mount...

Details Method of manufacturing mounting substrate and surface mount... Method of manufacturing mounting substrate and surface mount...

2006-05-23

2006-05-23

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S127000

Reexamination Certificate

active

07049174

ABSTRACT:
A method of manufacturing a mounting substrate accommodating therein an electronic component for use in a surface mount crystal oscillator and adapted to be joined to a bottom surface of a crystal unit has the steps of defining a recess with a bottom wall and a frame wall having an opening, placing the electronic component in the recess, filling the recess with a resin for protecting the electronic component, and, after the resin is cured, removing at least a portion of the frame wall. The electronic component typically comprises an IC (Integrated Circuit) chip incorporating an integrated oscillating circuit that employs a crystal unit.

REFERENCES:
patent: 5614443 (1997-03-01), Nakashima et al.
patent: 5949294 (1999-09-01), Kondo et al.
patent: 2004/0036547 (2004-02-01), Harima
patent: 10-98151 (1998-04-01), None

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