Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-12-13
2008-08-12
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C361S760000, C174S260000, C174S262000, C438S014000, C438S017000, C257S048000, C257S700000, C257SE21505
Reexamination Certificate
active
07410837
ABSTRACT:
A method for manufacturing a mounting substrate on which a semiconductor chip is mounted includes: forming a wiring section by electrolytic plating on a first face of a supporting substrate which is made of an insulating material, by supplying electric power from a first power supply layer through a via plug piercing through the supporting substrate, the first power supply layer being formed on a second face of the supporting substrate; performig patterning on the first power supply layer so as to form a first conductive pattern which is connected to the wiring section through the via plug; performing a connection test of the wiring section by using the conductive pattern; mounting the semiconductor chip on the wiring section; and removing the supporting substrate.
REFERENCES:
patent: 2005/0088833 (2005-04-01), Kikuchi et al.
patent: 2005/0211465 (2005-09-01), Sunohara et al.
patent: 2005/0252682 (2005-11-01), Shimoto et al.
patent: 11-112152 (1999-04-01), None
Kebede Brook
Rankin , Hill & Clark LLP
Scarlett Shaka
Shinko Electric Industries Co. Ltd.
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