Method of manufacturing mounting boards

Details Method of manufacturing mounting boards Method of manufacturing mounting boards

2007-01-16

2007-01-16

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C228S223000

Reexamination Certificate

active

10863398

ABSTRACT:
The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part11and a second electronic part12each having a solder bump in its bottom plane on a substrate3in stacked plural levels, after the first electronic part11is mounted on the substrate3that has been fed with solder, the solder bump18of the second electronic part12is mounted on the electrode17provided on the upper plane of the first electronic part11, and thereafter the substrate3is heated in a reflow step to solder-bond the first electronic part11to substrate3along with solder-bonding the second electronic part12to the first electronic part11.By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.

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patent: 6923875 (2005-08-01), Ikeda et al.
patent: 2002-217359 (2002-08-01), None

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