Method of manufacturing mount structure without introducing...

Details Method of manufacturing mount structure without introducing... Method of manufacturing mount structure without introducing...

2005-07-12

2005-07-12

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

With subsequent treating other than heating of bonded parts...

C228S248100

Reexamination Certificate

active

06915942

ABSTRACT:
A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted on the printed circuit board by reflow processing.

REFERENCES:
patent: 4832249 (1989-05-01), Ehler
patent: 5433368 (1995-07-01), Spigarelli
patent: 5560531 (1996-10-01), Ruszowski
patent: 5918795 (1999-07-01), Yamaguchi et al.
patent: 5928404 (1999-07-01), Paruchuri et al.
patent: 6077477 (2000-06-01), Sakai et al.
patent: 6095403 (2000-08-01), Akin et al.
patent: 6204490 (2001-03-01), Soga et al.
patent: 6214131 (2001-04-01), Hua
patent: 6230962 (2001-05-01), Leicht
patent: 6231691 (2001-05-01), Anderson et al.
patent: 6267823 (2001-07-01), Yamaguchi et al.
patent: 6340110 (2002-01-01), Nakamura et al.
patent: 6428745 (2002-08-01), Yamaguchi et al.
patent: 6575352 (2003-06-01), Takahashi et al.
patent: 6585149 (2003-07-01), Nakatsuka et al.
patent: 6616032 (2003-09-01), Gasse et al.
patent: 6617195 (2003-09-01), Master et al.
patent: 6642485 (2003-11-01), Goenka et al.
patent: 6648216 (2003-11-01), Yamaguchi et al.
patent: 6651870 (2003-11-01), Teshima et al.
patent: 6726087 (2004-04-01), Diehm et al.
patent: 2001/0018030 (2001-08-01), Yamaguchi et al.
patent: 2001/0025875 (2001-10-01), Yamaguchi et al.
patent: 2002/0011511 (2002-01-01), Takahashi et al.
patent: 2002/0093096 (2002-07-01), Tago et al.
patent: 2003/0005581 (2003-01-01), Watanabe et al.
patent: 2003/0096453 (2003-05-01), Wang et al.
patent: 2003/0121959 (2003-07-01), Yamaguchi et al.
patent: 2003/0156969 (2003-08-01), Choi et al.
patent: 2003/0201310 (2003-10-01), Nakatsuka et al.
patent: 2004/0045642 (2004-03-01), Bonet
patent: 2004/0056067 (2004-03-01), Yamaguchi et al.
patent: 2004/0112478 (2004-06-01), Bieler et al.
patent: 2004/0166370 (2004-08-01), Mizoguchi et al.
patent: 1198117 (1998-11-01), None
patent: 0 855 242 (1998-07-01), None
patent: 0 875 331 (1998-11-01), None
patent: 62 054996 (1987-03-01), None
patent: 01 312 892 (1989-12-01), None
patent: 2-307671 (1990-12-01), None
patent: 3-268386 (1991-11-01), None
patent: 4-109695 (1992-04-01), None
patent: 5-48376 (1993-06-01), None
patent: 06 120 652 (1994-04-01), None
patent: 08 078837 (1996-03-01), None
patent: 9-29480 (1997-02-01), None
patent: 9-82751 (1997-03-01), None
patent: 09 206 983 (1997-08-01), None
patent: 09216089 (1997-08-01), None
patent: 9-266373 (1997-10-01), None
patent: 11-26924 (1999-01-01), None
patent: 11-138292 (1999-05-01), None
patent: 11-245079 (1999-09-01), None
patent: 11-354919 (1999-12-01), None
patent: 2000 188464 (2000-07-01), None
patent: 2000-349433 (2000-12-01), None
patent: 2001-7507 (2001-01-01), None
patent: 2001-308507 (2001-11-01), None
patent: 2001-358456 (2001-12-01), None
patent: 2000-0005917 (2000-01-01), None
patent: 2000-0062454 (2000-10-01), None
patent: WO97/28923 (1997-08-01), None
Japanese Office Action dated Oct. 1, 2003 (w/ English trnaslation of relevant portion).
Korean Office Action dated Jun. 29, 2004 (w/ English trnaslation of relevant portion).
European Search Report issued Aug. 2, 2004.
Chinese Office Action issued Oct. 29, 2004.

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