Method of manufacturing modules with an integrated circuit

Details Method of manufacturing modules with an integrated circuit Method of manufacturing modules with an integrated circuit

2005-03-15

2005-03-15

Booth, Richard A. (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Reexamination Certificate

active

06867111

ABSTRACT:
In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).

REFERENCES:
patent: 6133835 (2000-10-01), DeLeeuw et al.

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