Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating contains embedded solid material
Patent
1994-10-04
1995-11-14
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating contains embedded solid material
205110, 205223, 427437, 4274431, C25D 548, C25F 304, C23C 1414
Patent
active
054663598
ABSTRACT:
According to a method of manufacturing a microwave tube collector of this invention, a copper plating layer in which powder particles of a material having a secondary electron emissivity of not more than 1 are dispersed and precipitated is formed on a surface of a collector electrode. Only the copper plating layer is selectively etched for a predetermined period of time to increase the degree of exposure and the surface area of the powder particles of the material having a secondary electron emissivity of 1 or more in the copper plating layer.
REFERENCES:
patent: 4119500 (1978-10-01), Ishizuka et al.
NEC Corporation
Niebling John
Wong Edna
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