Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2000-08-23
2003-05-13
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S014000, C438S016000, C438S017000, C438S018000, C349S073000, C349S074000, C349S113000, C349S153000, C349S155000, C349S158000
Reexamination Certificate
active
06562640
ABSTRACT:
BACKGROUND OF THE INVENTION
(a) Technical Field of the Invention
The present invention relates to a method of manufacturing micro-display, and in particular to a method which is used to screen base chips, and simplify and eliminate the number of “void” chips in the fabrication process.
(b) Description of the Prior Art
Micro-displays are widely used in electrical projection devices, such as projectors, computer displays, projection TV, etc. The main action of the micro-displays is to produce original images of optical projection and by means of the reflection function between individual pixels of the reflection mirrors to proceed with “ON” and “OFF” control and with the combination of optical projection light source and the optical projection mechanism of the lenses combination, the original images can be enlarged and projected onto screen or displaying screen. Thus, the application of micro-display is very wide and the numbers of micro-displays used in computer and optical projection are now increasing. As a result, the quantity of production of micro-displays is an important factor in the manufacturing method.
However, in conventional manufacturing methods, the external surrounding of each base chip of the wafer is provided with a sealant frame, and to each of the square of the chip of the wafer, spacing particles are dispensed thereto. After that, the ITO glass panel indicating the top layer of the micro-display, corresponding to the square of the chip, is punched. The ITO glass panel is then mounted onto the wafer which has been provided with the sealant frame. Each of the square of the chip is then vacuumed, injecting a liquid crystal and sealed and cut to form a preliminary product of micro-display, but the product has to be electrically inspected and tested so as to check whether each chip circuit is functioning normally so as to screen the final micro-display product.
In the prior art method of manufacturing, the chips on the wafer, whether there are “passed” or void chips, are undergone sealing, dispensing of spacing particles, combination of ITO glass panel, vacuuming, injection of liquid crystal, sealing, dicing, and testing step. Thus, it is more costly and more material, labour force and time are involved. This will increase difficulties in the manufacturing process. Besides, the post testing of products causes an increase of production cost, and the rate of inferior products will be increased.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a method of manufacturing micro-display, wherein based on the tested data of the wafer to screen “passed” chips for fabrication, the material used, labour force and cost involved in the fabrication process are greatly reduced.
Yet another object of the present invention to provide a method of manufacturing micro-display, wherein electrical testing process of chips within the wafer is simplified so as to greatly lower labour force and cost for post-testing and inspection of the obtained products.
Another further object of the present invention to provide a method of manufacturing micro-display, wherein the production of inferior products containing high pollutant (such as liquid crystal) and waste are greatly reduced.
Yet another aspect of the present invention is to provide a method of manufacturing micro-display comprising the steps of testing individual chips on a base wafer forming the micro-display, and the tested “void” chips being marked, inputting the testing data into a sealant/glue machine and a laser puncher; sealant/glue forming on the external surrounding of an “passed” chip a sealant frame by the sealant/glue machine; forming an injection hole on an ITO glass panel at a position corresponding to the position of the “passed” chip, by means of the laser puncher; dispensing spacing particles within a chip's square box which has been formed with the sealant frame; position-aligning the ITO glass panel onto the wafer based on the wafer testing data; injecting a liquid crystal via the injection hole of the ITO glass panel located on the top layer of the “passed” chip to the space between the chips and the ITO glass; and sealing and dicing handling of the ITO glass panel to precisely manufacture the micro-display with a passed chip circuit so as to precisely screen the good products, and simplify the required number for fabrication and process.
REFERENCES:
patent: 6005649 (1999-12-01), Krusius et al.
patent: 6275277 (2001-08-01), Walker et al.
Cheng Hao-Ming
Tseng Ling-Yuan
Berry Renee R
Rosenberg , Klein & Lee
Taiwan Micro Display Corporation
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