Etching a substrate: processes – Forming or treating article containing magnetically...
Reexamination Certificate
2011-08-09
2011-08-09
Vinh, Lan (Department: 1713)
Etching a substrate: processes
Forming or treating article containing magnetically...
C216S041000, C216S067000, C438S717000, C438S754000
Reexamination Certificate
active
07993536
ABSTRACT:
According to one embodiment, a method of manufacturing a magnetic recording medium includes forming a first hard mask, a second hard mask and a resist film on a magnetic recording layer, imprinting a stamper on the resist film to transfer patterns of recesses and protrusions, removing residues remained in recess of the patterned resist film, etching the second hard mask using the patterned resist film as a mask to transfer patterns of recesses and protrusions, etching the first hard mask using the patterned second hard mask as a mask to transfer patterns of recesses and protrusions, and deactivating magnetism of the magnetic recording layer exposed in the recesses together with removing the second hard mask by ion-beam etching.
REFERENCES:
patent: 6221519 (2001-04-01), Doi et al.
patent: 6266354 (2001-07-01), Chino et al.
patent: 6984529 (2006-01-01), Stojakovic et al.
patent: 7067207 (2006-06-01), Kamata et al.
patent: 2004/0253817 (2004-12-01), Imada et al.
patent: 2005/0243467 (2005-11-01), Takai et al.
patent: 2005/0284842 (2005-12-01), Okawa et al.
patent: 2006/0003551 (2006-01-01), Mancini et al.
patent: 2006/0021966 (2006-02-01), Hattori et al.
patent: 2006/0124585 (2006-06-01), Suwa et al.
patent: 2006/0222897 (2006-10-01), Kamata et al.
patent: 2006/0222899 (2006-10-01), Sugimura et al.
patent: 2007/0070547 (2007-03-01), Kamata et al.
patent: 2007/0211592 (2007-09-01), Sakurai et al.
patent: 2007/0224339 (2007-09-01), Kamata et al.
patent: 2007/0263324 (2007-11-01), Allen et al.
patent: 2007/0281078 (2007-12-01), Kikitsu et al.
patent: 2008/0075845 (2008-03-01), Sonobe et al.
patent: 2008/0078739 (2008-04-01), Hibi et al.
patent: 2008/0093336 (2008-04-01), Lee et al.
patent: 2008/0158718 (2008-07-01), Kobayashi et al.
patent: 2008/0174914 (2008-07-01), Takai et al.
patent: 2008/0217615 (2008-09-01), Kerber
patent: 2009/0023078 (2009-01-01), Gutmann et al.
patent: 2009/0305081 (2009-12-01), Dai et al.
patent: 2009/0308837 (2009-12-01), Albrecht et al.
patent: 2010/0018946 (2010-01-01), Isowaki et al.
patent: 2010/0018947 (2010-01-01), Kimura et al.
patent: 2010/0047625 (2010-02-01), Kamata et al.
patent: 2010/0053813 (2010-03-01), Fukushima et al.
patent: 2010/0059476 (2010-03-01), Yamamoto et al.
patent: 2010/0214694 (2010-08-01), Kimura et al.
patent: 2010/0214695 (2010-08-01), Isowaki et al.
patent: 2010/0215989 (2010-08-01), Isowaki et al.
patent: 02-207418 (1990-08-01), None
patent: 03-040219 (1991-02-01), None
patent: 05-205257 (1993-08-01), None
patent: 11-328652 (1999-11-01), None
patent: 2000-286241 (2000-10-01), None
patent: 2002-501300 (2002-01-01), None
patent: 2002-359138 (2002-12-01), None
patent: 2003-183859 (2003-07-01), None
patent: 2004-164692 (2004-06-01), None
patent: 2005-042143 (2005-02-01), None
patent: 2005-050468 (2005-02-01), None
patent: 2005-056535 (2005-03-01), None
patent: 2005-070650 (2005-03-01), None
patent: 2005-071542 (2005-03-01), None
patent: 2005-317155 (2005-11-01), None
patent: 2006-012332 (2006-01-01), None
patent: 2006-147148 (2006-06-01), None
patent: 2006-196143 (2006-07-01), None
patent: 2007-095115 (2007-04-01), None
patent: 2008-065944 (2008-03-01), None
patent: 2008-135092 (2008-06-01), None
patent: 2008-210450 (2008-09-01), None
patent: 2008-135092 (2008-12-01), None
patent: 2009-076924 (2009-04-01), None
patent: 2009-170007 (2009-07-01), None
patent: 2009-181674 (2009-08-01), None
patent: 2009-301655 (2009-12-01), None
patent: 2010-033636 (2010-02-01), None
Explanation of Non-English Language References.
Notice of Reasons for Rejection mailed by Japan Patent Office on Oct. 13, 2009 in Japanese Patent Application No. 2008-192537 (corresponding to U.S. Appl. No. 12/508,269).
Notice of Reasons for Rejection mailed by Japan Patent Office on Nov. 17, 2009 in Japanese patent application No. 2008-213674 (corresponding to U.S. Appl. No. 12/544,606).
Notice of Reasons for Rejection mailed by Japan Patent Office on Oct. 13, 2009 for Japanese Patent Application No. 2008-192536 (corresponding to U.S. Appl. No. 12/509,261).
Notice of Reasons for Rejection mailed by Japan Patent Office on Feb. 2, 2010 for Japanese Patent Application No. 2008-192536 (corresponding to U.S. Appl. No. 12/509,261).
Notice of Reasons for Rejection mailed by Japan Patent Office on Apr. 20, 2010 for Japanese Patent Application No. 2009-038207 (corresponding to U.S. Appl. No. 12/705,456).
Notice of Reasons for Rejection mailed by Japan Patent Office on Apr. 20, 2010 for Japanese Patent Application No. 2009-038206 (corresponding to U.S. Appl. No. 12/705,490).
Notice of Reasons for Rejection mailed by Japan Patent Office on Apr. 20, 2010 for Japanese Patent Application No. 2009-038208 (corresponding to U.S. Appl. No. 12/705,421).
Notice of Reasons for Rejection mailed by the Japan Patent Office on Mar. 9, 2010 in the corresponding Japanese patent application No. 2008-317382.
Isowaki Yousuke
Kamata Yoshiyuki
Kimura Kaori
Sakurai Masatoshi
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
Vinh Lan
LandOfFree
Method of manufacturing magnetic recording medium does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing magnetic recording medium, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing magnetic recording medium will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2711448