Method of manufacturing liquid-jet head and liquid-jet head

Details Method of manufacturing liquid-jet head and liquid-jet head Method of manufacturing liquid-jet head and liquid-jet head

2006-03-30

2009-08-11

Luu, Matthew (Department: 2861)

Metal working

Piezoelectric device making

C029S890100, C216S027000, C347S068000, C347S071000

Reexamination Certificate

active

07571525

ABSTRACT:
Included are the steps of: forming piezoelectric elements on a surface of a passage-forming substrate with a vibration plate in between, and forming a penetrating portion by removing an area in the vibration plate, which area will serve as a communicating portion; forming lead electrodes and sealing up the penetrating portion with an interconnect layer; joining a reservoir forming plate to a surface of a passage-forming substrate; forming liquid passages by wet-etching; forming protection films on inner surfaces of the liquid passages; detaching and removing a protection film on an interconnect layer; and causing a reservoir portion and a communicating portion to communicate with each other by removing a corresponding part of the interconnect layer, and in accordance with the manufacturing method, while the liquid passages are being formed, the communicating portion is formed in a way that an edge of an opening of the vibration plate is located outside an edge of an opening which is close to the penetrating portion, and in a way that at least the edge of the opening of the penetrating portion is thus configured of only any one of the vibration plate and the interconnect layer.

REFERENCES:
patent: 2005/0262691 (2005-12-01), Torimoto et al.
patent: 2003-159801 (2003-06-01), None

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