Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-11-27
2007-11-27
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S041000, C216S058000, C216S067000, C438S021000, C347S054000, C347S065000
Reexamination Certificate
active
11481796
ABSTRACT:
The method of manufacturing a recording head has a flow path wall forming step of forming flow path walls on a substrate having energy generating elements formed thereon, an imbedded material depositing step of depositing an imbedded material between the flow path walls and on a top of each flow path wall, a flattening step of polishing a top of the deposited imbedded material, until the top of the flow path wall is exposed, and a step of forming an orifice plate on the tops of the polished imbedded material and the exposed flow path wall. In the step of forming the flow path walls, patterning of a close contact property improvement layer is simultaneously performed to improve a close contact property between the flow path wall and the substrate.
REFERENCES:
patent: 5478606 (1995-12-01), Ohkuma et al.
patent: 6139761 (2000-10-01), Ohkuma
patent: 6145965 (2000-11-01), Inada et al.
patent: 6390606 (2002-05-01), Terui et al.
patent: 6638439 (2003-10-01), Shimomura
patent: 7005244 (2006-02-01), Park et al.
patent: 7070912 (2006-07-01), Park et al.
patent: 2005/0117005 (2005-06-01), Fujii et al.
patent: 2005-104156 (2005-04-01), None
patent: 2005-205916 (2005-08-01), None
patent: 10-2005-0069456 (2005-07-01), None
Office Action dated Jun. 21, 2007, issued in Korean patent application No. 10-2006-68933, with partial English-language translation.
Fujii Kenji
Koyama Shuji
Murayama Hiroyuki
Ohsumi Masaki
Tagawa Yoshinori
Ahmed Shamim
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
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