Method of manufacturing light emitting diode device

Details Method of manufacturing light emitting diode device Method of manufacturing light emitting diode device

2011-01-25

2011-01-25

Chen, Jack (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S029000, C438S033000, C438S108000, C257SE33001

Reexamination Certificate

active

07875473

ABSTRACT:
A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

REFERENCES:
patent: 7195944 (2007-03-01), Tran et al.

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