Method of manufacturing light-emitting diode

Details Method of manufacturing light-emitting diode Method of manufacturing light-emitting diode

2010-01-13

2010-10-12

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000, C438S119000, C257SE21502

Reexamination Certificate

active

07811843

ABSTRACT:
A method of manufacturing an LED includes the following steps: preparing an LED wafer including a substrate and an epitaxial layer formed on the substrate; cutting the epitaxial layer of the LED wafer into a plurality of LED dies with a gap defined between every two neighboring dies; filling an electrically insulating material in each gap between neighboring LED dies such that the neighboring LED dies are separated from each other by the insulating material; providing a circuit board having a layer of anisotropic conductive adhesive coated thereon; pressing the LED dies against the adhesive to bring the top surfaces of the LED dies into contact with the adhesive such that the LED dies each are electrically connected to the circuit board via the adhesive; and encapsulating the LED dies with a light penetrable material.

REFERENCES:
patent: 2010/0022039 (2010-01-01), Chang

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