Method of manufacturing lead frame having inner lead connected t

Details Method of manufacturing lead frame having inner lead connected t Method of manufacturing lead frame having inner lead connected t

1996-10-15

1999-08-10

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, 438112, H01L 2144, H01L 2160

Patent

active

059372788

ABSTRACT:
A method of manufacturing a lead frame comprises the steps of preparing a three-layered material comprising a metal base, an etching stopper layer made of a metal material different from that of the metal layer formed on a first surface of the metal base and a chromium layer formed on the etching stopper layer, forming a resist layer having a negative pattern relative to an inner lead to be formed on the chromium layer of the three-layered material, forming an inner lead by plating copper by using the resist layer as a mask, forming an outer lead on the metal base, removing a back of a region in which an inner lead of the metal base is formed by etching, removing the etching stopper layer, and removing the chromium layer.

REFERENCES:
patent: 4736236 (1988-04-01), Butt
patent: 5221428 (1993-06-01), Ohsawa et al.
patent: 5349238 (1994-09-01), Ohsawa et al.
patent: 5437764 (1995-08-01), Ohsawa et al.
patent: 5767569 (1998-06-01), Ohta et al.

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