Method of manufacturing laminated electronic component

Details Method of manufacturing laminated electronic component Method of manufacturing laminated electronic component

1993-01-22

1995-05-23

Fiorilla, Christopher A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156235, 156246, B32B 3104, B32B 1800

Patent

active

054177847

ABSTRACT:
A method of manufacturing a laminated electronic component such as a laminated ceramic capacitor, for example, which includes the steps of preparing a ceramic sheet provided with orientation marks, punching the ceramic sheet on the basis of the positions of the orientation marks, and stacking such ceramic sheets on the basis of the positions of the orientation marks. The punching step and the stacking step, which require alignment, are carried out on the basis of the positions of the orientation marks, whereby the ceramic sheets are stacked with high accuracy of alignment in the laminated electronic component as obtained.

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