Method of manufacturing laminated ceramic electronic parts

Details Method of manufacturing laminated ceramic electronic parts Method of manufacturing laminated ceramic electronic parts

1996-07-26

1999-09-07

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 8916, 156246, 156249, 156252, 156257, 1562728, B32B 3112

Patent

active

059482001

ABSTRACT:
A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.

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