Method of manufacturing laminated ceramic capacitors

Details Method of manufacturing laminated ceramic capacitors Method of manufacturing laminated ceramic capacitors

1993-09-24

1995-08-15

Vo, Peter

Metal working

Electric condenser making

Solid dielectric type

29 2535, 361309, 3613212, H01G 700, H01G 412

Patent

active

054407940

ABSTRACT:
A method of manufacturing an electronic component including a step wherein green-sheets each having one main surface on which a number of first interior electrodes or second interior electrodes are printed and green-sheets each having no printed electrodes are laminated in a direction orthogonally intersecting the respective main surfaces of the green-sheets so as to form a block, which is then fired. The fired block is cut or sliced in the direction orthogonally intersecting the main surface of the green-sheets so as to form a mother board with respective ends of the first interior electrodes and the second interior electrodes exposed on one main surface and the other main surface of the mother board, respectively. Thereafter, respective exterior electrodes are applied onto both main surfaces of the mother board and chips are cut out of the mother board, whereby laminated capacitors each having a first exterior electrode and a second exterior electrode respectively connected to the first interior electrodes and the second interior electrodes can be obtained.

REFERENCES:
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patent: 4191905 (1980-03-01), Yasuda et al.
patent: 4445256 (1984-05-01), Huguenin et al.
patent: 4572981 (1986-02-01), Zola
patent: 4931901 (1990-06-01), Heron, Jr.
patent: 4953273 (1990-09-01), Insetta et al.
patent: 5197170 (1993-03-01), Senda et al.
patent: 5245734 (1993-09-01), Issartel
Miller et al "Chip Capacitor Configuration" IBM Technical Disclosure Bulletin, vol. 10, No. 7, Dec. 1967, p. 941.

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