Method of manufacturing ITO sputtering target

Details Method of manufacturing ITO sputtering target Method of manufacturing ITO sputtering target

1990-11-21

1992-03-10

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

501126, 501134, F27D 700, C04B 3550

Patent

active

050947877

ABSTRACT:
In manufacturing a high-density ITO sputtering target by press-molding a powder mixture consisting essentially of indium oxide and tin oxide is compacted and the resulting compact is sintered. The sintering is performed in an atmosphere of oxygen under a pressure of at least one atmosphere (gauge pressure). The present invention offers very advantageous effects from the industrial viewpoint in that it permits mass production of high-performance, high-density ITO targets at low cost using mass productivity.

REFERENCES:
patent: 4962071 (1990-10-01), Bayard
Fraser et al., J. Electrochem. Soc.: "Solid State Science and Technology", 119 (10), 1368-1374 (1972).

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