Optics: eye examining – vision testing and correcting – Spectacles and eyeglasses – Ophthalmic lenses or blanks
Patent
1995-06-23
1999-02-02
Sparks, Donald
Optics: eye examining, vision testing and correcting
Spectacles and eyeglasses
Ophthalmic lenses or blanks
29827, 174 524, 257666, 257676, 257692, 257735, 361760, 438123, 438611, 438617, H05K 502, H01R 4316, H01L 23495, H01L 2160
Patent
active
RE0360775
ABSTRACT:
A method of manufacturing inversion ICs includes the steps of connecting a first electrode pad group of a semiconductor chip to a second lead group via wires, connecting a second electrode pad group of the semiconductor chip to a first lead group via wires, sealing the semiconductor chip, the first and second lead groups, and the wires in a resin so that the outer lead portions of the leads are exposed, and bending the outer lead portions of the leads toward the bottom surface of the semiconductor chip. An IC module includes a mounting substrate, a standard IC mounted on the top surface of the mounting substrate, an inversion IC mounted on the bottom surface of the mounting substrate so that the leads providing connections to the same functions in the standard and inversion ICs are at the same point on opposite sides of the mounting substrate, and a plurality of connecting members on the mounting substrate, electrically connecting the opposed leads of the standard IC and the leads of the inversion IC together.
REFERENCES:
patent: 4710680 (1987-12-01), Nakatani et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4891789 (1990-01-01), Quattrini et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4994896 (1991-02-01), Uemura et al.
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5229329 (1993-07-01), Chai et al.
patent: 5297107 (1994-03-01), Metzerger et al.
patent: 5309020 (1994-05-01), Murasawa et al.
patent: 5327009 (1994-07-01), Igeta
patent: 5432127 (1995-07-01), Lamson et al.
patent: 5508565 (1996-04-01), Hatakeyama et al.
IBM Technical Disclosure Bulletin, "System Electronic Packaging Architecture" vol. 38 No. 12 pp. 13-16, Dec. 1995.
IBM Technical Disclosure Bulletin "High Density and Speed Performance Chip Joining Procedure and Package" by P.F. lafrate vol. 15 No. 4, Sep. 1972.
Proceedings of the Electronic Components Conference, Los Angeles CA, IEEE, N.Y., US, pp. 552-557; W.C. Ward: "Volume Production of Unique Plastic Surface-Mount Modules . . . Techniques", May 1988.
Michii Kazunari
Seki Hiroshi
Mitsubishi Denki & Kabushiki Kaisha
Sparks Donald
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