Method of manufacturing interconnection structure of a semicondu

Details Method of manufacturing interconnection structure of a semicondu Method of manufacturing interconnection structure of a semicondu

1997-03-25

1998-01-27

Bowers, Jr., Charles L.

Fishing, trapping, and vermin destroying

437194, 437195, 437192, H01L 21283

Patent

active

057121400

ABSTRACT:
An aluminum interconnection film has a three layered structure of an aluminum alloy film, a tungsten film, and a titanium nitride film. An aluminum interconnection film and a second aluminum interconnection film are electrically connected through a through hole formed in a silicon oxide film. Because light reflectivity of the titanium nitride film is low, the exposed area of the resist can be kept within a predetermined area even if photolithography is carried out above a step where light is irregularly reflected. Therefore, it is possible to form a through hole of a desired dimension even if the through hole is formed above the step. Even if the titanium nitride film is etched and removed in forming the through hole, the aluminum alloy film is not exposed since the etching speed of the silicon oxide film is considerably slower than that of the tungsten film. The problem of denatured layer formation and residue formation caused by exposure of aluminum alloy film does not occur.

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