Method of manufacturing interconnect bumps

Details Method of manufacturing interconnect bumps Method of manufacturing interconnect bumps

1991-05-31

1994-02-08

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29852, H01R 909, H01K 310

Patent

active

052839486

ABSTRACT:
A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a height substantially greater than prior art bumps, while remaining structurally intact. The interconnect bumps are formed using standard photolithography techniques to form the bumps in multiple interlocking portions to achieve a structurally superior interconnect bump.

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