Method of manufacturing integrated circuits having electronic co

Details Method of manufacturing integrated circuits having electronic co Method of manufacturing integrated circuits having electronic co

1990-12-13

1991-12-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 43, 437 60, 437195, 148DIG14, H01L 21336

Patent

active

050752464

ABSTRACT:
A method of manufacturing integrated circuits includes steps: forming a first layer of polycrystalline silicon on areas of a semiconductor substrate previously covered with a dielectric material; forming a first insulating layer and a second thin layer of polycrystalline silicon acting as a shield; removing the second layer of polycrystalline silicon and the first insulating layer except from predetermined areas for containing a first type of electronic component; doping the exposed portion of the first layer of polycrystalline silicon; forming, by deposition, masking and removal, of a second insulating layer on the first layer of polycrystalline silicon in an area for containing a second type of electronic component; forming of a third layer of polycrystalline silicon; masking predetermined zones of this latter layer lying at least partially above the areas intended for the two types of electronic components, and removing the polycrystalline silicon external to these predetermined zones. The method continues with conventional steps and makes it possible to obtain, for instance, EPROM memory cells and capacitors using the same polycrystalline silicon depositing steps for forming their electrodes, without dispensing with the maximum freedom and precision in the choice of the physical characteristics and dimensions of the two types of components.

REFERENCES:
patent: 4441249 (1984-04-01), Alspector et al.
patent: 4536947 (1985-08-01), Bohr et al.
patent: 4639274 (1987-01-01), Krishna
patent: 4905064 (1990-02-01), Yabu et al.
patent: 4971924 (1990-11-01), Tigelaar et al.

Affiliated with

Also associated with

Rating

Method of manufacturing integrated circuits having electronic co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing integrated circuits having electronic co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing integrated circuits having electronic co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-43166