Method of manufacturing integrated circuit package system...

Details Method of manufacturing integrated circuit package system... Method of manufacturing integrated circuit package system...

2011-02-22

2011-02-22

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21499

Reexamination Certificate

active

07892894

ABSTRACT:
An integrated circuit package system includes: providing an integrated circuit wafer having an active side and a backside; forming a stress-relieving layer on the backside; forming an adhesion layer on the stress-relieving layer; dicing the integrated circuit wafer into a semiconductor chip with the stress-relieving layer and the adhesion layer on the backside of the semiconductor chip; and mounting the semiconductor chip over electrical interconnects.

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