Method of manufacturing insulation substrate for semiconductor d

Details Method of manufacturing insulation substrate for semiconductor d Method of manufacturing insulation substrate for semiconductor d

1991-07-23

1993-12-21

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, B32B 900

Patent

active

052719936

ABSTRACT:
In manufacturing an insulation substrate used in a semiconductor device, a metal plate (10) having relatively thick body portions (11a, 11b, 11c) and relatively thin linkage portions (12,13) is prepared. The body portions are spaced from each other and the linkage portions link up the respective body portions. The metal plate is fixed to a metal flat plate (1) through a resin layer (2). The linkage portions are then removed through selective etching. The structure thus obtained is cut into a plurality of unit structures, to thereby obtain an in insulation substrate having conductive circuit patterns thereon.

REFERENCES:
patent: 3508984 (1970-04-01), Travis
patent: 4985294 (1991-01-01), Watanabe et al.
patent: 5039570 (1991-08-01), Sturm
Third IEEE/CHMT International Electronic Manufacturing Technology Symposim, Oct. 12-14, 1987, pp. 2-9, Norio Miura, "Circuit Assembly Innovation by Insulated Metal Substrate Technology".

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