Abrasive tool making process – material – or composition – With inorganic material – Metal or metal oxide
Patent
1992-03-25
1994-09-13
Bell, Mark L.
Abrasive tool making process, material, or composition
With inorganic material
Metal or metal oxide
51293, 501 87, 501 89, 501 91, 501 92, 501 93, 501 95, B24D 334, C04B 3552
Patent
active
053465172
ABSTRACT:
The present invention relates to whisker reinforced ceramic bodies with new and improved properties. By replacing the tool pressing with injection molding, surprisingly a more homogeneous structure and more advantageous whisker orientation has been obtained. By choosing the conditions of the molding, it is possible to control the whisker orientation to get optimal material properties. Bodies according to the invention are particularly suitable for chip forming machining of heat resistant materials.
REFERENCES:
patent: 4543345 (1985-09-01), Wei
patent: 4745091 (1988-05-01), Landingham
patent: 4789277 (1988-12-01), Rhodes et al.
patent: 4804645 (1989-02-01), Ekstrom
patent: 4849381 (1989-07-01), Brandt et al.
patent: 4867761 (1989-09-01), Brandt et al.
patent: 4920838 (1990-05-01), Brandt et al.
patent: 5057465 (1991-10-01), Sakamoto et al.
patent: 5059564 (1991-10-01), Mehrotra et al.
patent: 5110770 (1992-05-01), Brandt et al.
Becher et al. Communications of the American Ceramic Society, Dec. 1984, "Toughened Behavior in SiC-Whisker-Reinforced Alumina", pp. C267-C269.
Patent Abstracts of Japan, vol. 14, No. 47 (C-682) Jan. 29, 1990 & JP 1,278,479 (Hitachi Metals Ltd.) Nov. 8, 1989.
Bell Mark L.
Jones Deborah
Sandvik AB
LandOfFree
Method of manufacturing inserts preferably for machining of heat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing inserts preferably for machining of heat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing inserts preferably for machining of heat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1117447