Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1985-11-18
1987-08-25
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156245, 1563045, 29848, 29849, 29852, 206557, 206563, 206564, 2643281, 2643282, 2643288, 361412, 361414, 439 85, 439 55, B29C 4503
Patent
active
046891030
ABSTRACT:
A plurality of physically separate plastic substates are injection molded, each with at least one pattern of channels formed in a surface of thereof defining a conductive circuit to be formed. The plurality of substrates are then physically connected in a common planar array either by inserting them in corresponding receptacles in a carrier board, by mating peripheral connecting elements, by using adhesive or by some other suitable connecting mechanism. Where a carrier board with pre-formed receptacles is not utilized, the individual substrates in the array are pierced and replaced. The planar array is processed to simultaneously form a conductive circuit on each substrate consisting of metal deposited in its pattern of channels. The planar array of metallized substrates may then be stuffed with electronic components on an automatic insertion machine, wave soldered. The individual finished circuit boards are then pressed out. This batch processing results in substantial savings in handling costs and avoids the significant expense and tolerance problems associated with using very large molds which would be required to form the large planar array directly.
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E. I. Du Pont de Nemours and Company
Weston Caleb
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