Method of manufacturing individual element arrays

Details Method of manufacturing individual element arrays Method of manufacturing individual element arrays

1993-04-07

1994-10-25

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156257, 156268, 1562728, 1562722, 437226, B32B 3118, B32B 3128

Patent

active

053585909

ABSTRACT:
A method of manufacturing a plurality of individual element arrays, including the steps of forming a wafer including a substrate and a plurality of elements formed on the substrate; bonding a transparent protective tape to an upper surface of the wafer to protect the wafer; bonding a supporting tape to a lower surface of the wafer to support the wafer; and cutting the transparent protective tape, the wafer and an upper portion of the supporting tape to form the individual element arrays separated from each other. Accordingly, attachment of dust onto the upper surface of the wafer can be surely prevented by the protective tape in cutting the wafer. Further, accurate cutting of the wafer into a desired shape can be ensured owing to the transparency of the protective tape.

REFERENCES:
patent: Re32571 (1988-01-01), Burger
patent: 4270317 (1988-01-01), Kuroda
patent: 4473424 (1989-09-01), Sorko-Ram

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