Method of manufacturing hybrid integrated circuit assemblies

Details Method of manufacturing hybrid integrated circuit assemblies Method of manufacturing hybrid integrated circuit assemblies

1979-03-19

1981-06-02

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

29418, 29760, 361400, H05K 334

Patent

active

042702658

ABSTRACT:
Electronic components and a conductor for connecting the electronic components are placed in the component positioning holes and the conductor positioning recess which are formed in a plate-shaped jig. The jig with the components and the conductor is placed over a mounting board, and the assembly of these elements is heated in a suitable furnace so that the electronic components are connected to the mounting board and the conductor simultaneously, thereby to reduce the number of steps of manufacturing the hybrid integrated circuit assembly.

REFERENCES:
patent: 2740097 (1956-03-01), Edelman et al.
patent: 3218585 (1965-11-01), May
patent: 3247577 (1966-04-01), Jaremus et al.
patent: 3266125 (1966-08-01), Tobolski
patent: 3540718 (1970-11-01), Heffron et al.
patent: 3665590 (1972-05-01), Percival
patent: 4158877 (1979-06-01), Peterson

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