Method of manufacturing high density encapsulated wire circuit b

Details Method of manufacturing high density encapsulated wire circuit b Method of manufacturing high density encapsulated wire circuit b

1985-09-11

1987-05-05

Ball, Michael

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29850, H05K 103

Patent

active

046629637

ABSTRACT:
A method of making a high density dimensionally stable encapsulated circuit board. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.
At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.

REFERENCES:
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 4030190 (1977-06-01), Varker
patent: 4097684 (1978-06-01), Burr

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