Etching a substrate: processes – Forming or treating an article whose final configuration has...
Patent
1994-12-12
1997-08-12
Nguyen, Tuan H.
Etching a substrate: processes
Forming or treating an article whose final configuration has...
445 50, 216 40, 438 20, 438951, H01L 2170
Patent
active
056565259
ABSTRACT:
A new method for forming an array of high aspect ratio field emitter for flat panel Field Emission Displays (FEDs) was accomplished. The method involves forming on an insulated substrate an array of parallel cathodes and then depositing a dielectric layer and forming a array of parallel gate electrodes essentially orthogonal to the array of cathode electrodes. Opening are then made in the upper gate electrodes and dielectric layer over the lower cathode electrodes. The field emitters with high aspect-ratios are then formed on the cathode by depositing an emitter material, such as molybdenum, in the opening while heating the substrate to high temperatures. The emitter material is removed elsewhere on the substrate by utilizing a release layer and thereby completing the gated field emitter. This high temperature method results in high aspect-ratio gated emitters that allow the inter-electrode dielectric layer to be increased and thereby improving the circuit performance.
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Chang Kyan-Lun
Chao-Chi Peng
Lin Ching-Yuan
Wang Jermmy J. M.
Industrial Technology Research Institute
Nguyen Tuan H.
Saile George O.
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