Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2010-12-14
2011-11-22
Cazan, Livius R (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S848000, C029S852000, C174S261000, C174S256000, C174S262000, C174S264000, C264S328100, C361S750000, C361S751000, C419S011000, C419S065000, C428S209000
Reexamination Certificate
active
08061025
ABSTRACT:
A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
REFERENCES:
patent: 4221925 (1980-09-01), Finley et al.
patent: 4495378 (1985-01-01), Dotzer et al.
patent: 4769270 (1988-09-01), Nagamatsu et al.
patent: 6323439 (2001-11-01), Kambe et al.
patent: 6373000 (2002-04-01), Nakamura et al.
patent: 6869664 (2005-03-01), Vasoya et al.
patent: 7663226 (2010-02-01), Cho et al.
patent: 05110219 (1993-04-01), None
patent: 05-200877 (1993-08-01), None
patent: 2004-031765 (2004-01-01), None
patent: 10-2004-0027326 (2004-04-01), None
patent: 10-2005-0092225 (2005-09-01), None
Machine Translation of JP05110219A, obtained Mar. 26, 2011.
U.S. Appl. No. 12/003,490, filed Dec. 26, 2007, Seung Hyun Cho et al., Samsung Electro-Mechanics Co., Ltd.
Korean Office Action issued on Sep. 29, 2008 in corresponding Korean Patent Application.
Korean Office Action issued on Apr. 29, 2009 and issued in corresponding Korean Patent Application 10-2007-0059556.
U.S. Patent Office Action, mailed Jan. 14, 2010, issued in corresponding U.S. Appl. No. 12/003,490.
U.S. Patent Office Action, mailed Apr. 8, 2010, issued in corresponding U.S. Appl. No. 12/003,490.
U.S. Patent Notice of Allowance mailed Oct. 8, 2010 issued in corresponding U.S. Appl. No. 12/003,490.
Cho Seung Hyun
Cho Soon Jin
Choi Jin Won
Min Byoung Youl
Cazan Livius R
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Method of manufacturing heat radiation substrate having... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing heat radiation substrate having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing heat radiation substrate having... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4277287