Method of manufacturing flotox type eeprom

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S706000, C438S745000

Reexamination Certificate

active

07030025

ABSTRACT:
Disclosed herein is a method of manufacturing a FLOTOX type EEPROM. According to the method, the thickness of an oxide film in a tunneling implanted region is formed thicker than that of an oxide film in a peripheral active region by use of enhanced oxidation of the tunneling implanted region. Then, a tunnel window region and the peripheral active region are dry-etched simultaneously and an etching end point of the peripheral active region is detected. Thereafter, the oxide film that remains in the tunnel window region is removed by wet etching.

REFERENCES:
patent: 4477825 (1984-10-01), Yaron et al.
patent: 4701776 (1987-10-01), Perlegos et al.
patent: 5491101 (1996-02-01), Miyamoto et al.
patent: 6165846 (2000-12-01), Carns et al.
patent: 6586765 (2003-07-01), Lin et al.
patent: 61-228672 (1986-10-01), None
patent: 04-145666 (1992-05-01), None
patent: 04-207084 (1992-07-01), None
patent: 2001-210730 (2001-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing flotox type eeprom does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing flotox type eeprom, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing flotox type eeprom will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3560116

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.