Method of manufacturing flip chip resistor

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S619000, C029S620000, C338S307000

Reexamination Certificate

active

07089652

ABSTRACT:
The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.

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