Method of manufacturing flat wiring body

Details Method of manufacturing flat wiring body Method of manufacturing flat wiring body

1995-09-29

1997-08-12

Dixon, Merrick

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156268, 1562753, 264152, B32B 3100

Patent

active

056561156

ABSTRACT:
A conductor foil laminated on a carrier tape via a sticking layer is stamped out so as to form cut lines on boundaries among a wiring pattern part, a first conductor remainder part forming an outer region enclosing the wiring pattern part, and a second conductor remainder part other than the wiring pattern part and the first conductor remainder part. Next, out of the conductor foil, only the first conductor remainder part is peeled from the carrier tape, and then a first insulating tape with an adhesive layer which is in a solid state at an ordinary temperature is laminated on the carrier tape. Only a region of the adhesive layer with which the wiring pattern part is covered is heated with compression by a lower hot plate so that the wiring pattern part is adhered to the insulating tape. Then, the carrier tape is peeled from the insulating tape so as to be separated therefrom at a steep angle and the second conductor remainder part at a non-adhesion state is removed. Finally, the second insulating tape is laminated on the first insulating tape and the resultant thus obtained is punched into a desired figure. In the step of adhering the wiring pattern part in a transferring step, the laminated tape is disposed in a chamber and is heated with compression under a reduced pressure, thereby preventing air bubbles from entering an interface between the wiring pattern part and the first insulating tape.

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