Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-11-19
2010-06-08
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S017000, C438S257000, C438S598000, C257SE23002
Reexamination Certificate
active
07732226
ABSTRACT:
Disclosed are methods of manufacturing a flash memory device. The method can include performing a first test on memory banks of chips on a wafer to record an availability of the banks; performing an inking process on each of the chips according to a number of available banks in the chip; performing a sawing process to divide the chips mounted on the wafer; packaging the divided chips according to the number of available banks in the chip; and performing a verification test on the packaged chips.
REFERENCES:
patent: 5263003 (1993-11-01), Cowles et al.
patent: 5822244 (1998-10-01), Hansen et al.
patent: 6033955 (2000-03-01), Kuo et al.
patent: 6400602 (2002-06-01), Takata et al.
patent: 2001/0038554 (2001-11-01), Takata et al.
patent: 2004/0172496 (2004-09-01), Schoepflin et al.
patent: 2008/0237592 (2008-10-01), Sugita et al.
patent: 2010/0030949 (2010-02-01), Lakhani et al.
patent: 10-0192588 (1999-01-01), None
patent: 10-0716552 (2007-05-01), None
Dongbu Hitek Co., Ltd.
Lebentritt Michael S
Saliwanchik Lloyd & Saliwanchik
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