Method of manufacturing flash memory cards

Details Method of manufacturing flash memory cards Method of manufacturing flash memory cards

2005-11-02

2009-02-03

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S113000, C438S124000, C438S462000

Reexamination Certificate

active

07485501

ABSTRACT:
A method is disclosed for forming semiconductor packages by a process of punching and cutting the packages from a panel of integrated circuits. During an encapsulation process for encapsulating the packages in a molding compound, portions of the panel may be left free of molding compound. Portions of the panel left free of molding compound may subsequently be punched from the panel. These punched areas may define chamfers, notches or a variety of other curvilinear, rectilinear or irregular shapes in the outer edges of the finished semiconductor package. After the panel is punched, the integrated circuits may be singulated. By punching areas from the panel, and then cutting along straight edges, a simple, effective and cost efficient method is disclosed for obtaining finished semiconductor packages of a variety of desired shapes.

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