Method of manufacturing film carrier type substrate

Details Method of manufacturing film carrier type substrate Method of manufacturing film carrier type substrate

1992-06-04

1996-03-05

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437245, H01L 2144

Patent

active

054967724

ABSTRACT:
A film carrier type substrate includes a film made of organic high molecular substance, a metal layer formed over the film by depositing metal vapor and irradiating nitrogen gas ions on the film and a mixing layer made of a mixture of the materials of both the metal layer and the film formed in the interface between the metal layer and the film. Prior to forming the metal layer, inert gas ions and/or nitrogen gas ions may be irradiated on the film in advance.

REFERENCES:
patent: 4886681 (1989-12-01), Clabes et al.
"Metal/Polyimide Adhesion Improvement by Metal Deposition with Ion Bombardment," IBM Technical Disclosure Bulletin, vol. 32, No. 2, Jul. 1989, p. 261.
"Super-Adhesive Bonding of Metal to Polyimide," IBM Technical Disclosure Bulletin, vol. 30, No. 7, Dec. 1987, pp. 227-228.
"Handbook of Thin Film Technology," L. I. Maissel et al., McGraw-Hill, 1970, pp. 7-1, 7-3, 7-24.
"Interface Toughening by Ion Implantation for Enhancement of Thin Film Adhesion," IBM Technical Disclosure Bulletin, vol. 33, No. 1B, Jun. 1990, pp. 69-71.

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