Method of manufacturing eprom device

Details Method of manufacturing eprom device Method of manufacturing eprom device

1985-01-04

1988-08-23

Chaudhuri, O.

Fishing, trapping, and vermin destroying

437219, 174 52PE, 357 74, H01L 2310, H01L 2318

Patent

active

047660953

ABSTRACT:
A method of manufacturing an EPROM IC device encapsulated in a plastic-molded package having a window for passing ultraviolet rays therethrough. An EPROM IC chip is fixed to a chip mounting region of a lead frame. The EPROM IC chip is placed in a hollow container made of a material capable of passing ultraviolet rays therethrough. A resin material capable of passing ultraviolet rays therethrough is introduced into the hollow container. A resultant structure is encapsulated plastic material except a surface of the hollow container, above the EPROM IC chip.

REFERENCES:
patent: 3611861 (1971-10-01), Schulze
patent: 3660819 (1972-05-01), Bentchkowsky
patent: 4326214 (1982-04-01), Trueblood
patent: 4460915 (1984-07-01), Engel

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